Semiconductor Metrology & Inspection

An Owens Design Specialty

  • 20 products developed for 15 Semiconductor OEMs
  • 520 systems shipped worldwide

Semiconductor Metrology & Inspection Development Services

The integration of metrology and inspection into semiconductor manufacturing is crucial to improving yields, ensuring product quality, and reducing production costs.

Owens Design is the world leader in partnering with semiconductor OEMs to design and manufacture fab-ready equipment for semiconductor manufacturers worldwide. Since 2003, we have developed more than 20 product lines for startup to tier 1 semiconductor OEMs and have shipped over 520 production systems. We partner with OEMs from concept development to prototype build to high volume manufacturing. Many of the systems are fully tested at Owens Deisgn and drop-shipped directly to the semiconductor end-customer.

Owens Design integrates your proprietary metrology or inspection technology into our semi-custom platform including wafer handling, staging and environmental controls to create manual load to fully automated systems.


Business Proposition

Developing new metrology or inspection technologies for an advanced semiconductor fab is a highly complex endeavor requiring specialized knowledge and significant capital expense. Owens Design reduces the development expense and risk to develop these complex systems by providing a customizable system platform and a complete manufacturing infrastructure for on-going system manufacturing including changes, configuration management, reliability, and cost reduction.

Owens Design has integrated more metrology and inspection technology systems for leading semiconductor OEMs than any other engineering firm worldwide. We design and build fab-ready prototypes that often go directly into semiconductor fabs to accelerate your time-to-market.

Semiconductor Equipment Expertise

Our flexible platform enable customization the specific requirements of our customers’ measurement technology. The platform includes wafer handling, staging, contamination and environment control, integration of our customer’s measurement sub-system, and final system test and shipment.

Wafer Handling Systems with Customized Configurations

  • EFEM, FOUP, SMIF, wafer ID
  • All substrate types and sizes, thinned wafers, and unusual form factors
    • Si, SiC, GaN, glass/ceramic, III-V, II-VI
    • Film-frames, packages, PCBs, masks
  • All end effector types: vacuum, edge, flipping, and non-contact

Precision Wafer Staging Systems

  • Custom development or integrated third-party
  • High precision (sub-micron), mechanical or air bearing, linear or rotary scanning
  • Hi-vacuum compatible
  • Customized platen design, backside contamination control, micron level flatness and leveling

Controlled Environments

  • ISO Class 1, ISO 2 with mechanisms, customer validated
  • Vibration and acoustic noise Isolation
  • Temperature, vacuum, humidity, O2, B-field, light tight

Process Integration

  • Probes
  • Cameras, imagers and spectrometers
  • IR, VIS, UV lamps, and lasers
  • E-beam and SEM
  • X-ray imaging

Standards Compliance, EFEM & SECS/GEM Integration

  • Semi, I3000i, CE, UL
  • Production qualified by all major semiconductor fabs
  • Trusted by fabs for next generation product testing


  • System software, HMI, calibration, maintenance utilities and field support documentation
  • Full system integration, testing, configuration management, and drop shipment to end-user fab