Cost effective heating and cooling of 300mm wafers without contamination is extremely difficult. Owens Design has developed a 300 mm wafer pre-heat and post-cool station that provides excellent temperature uniformity, rapid heating and cooling and industry leading backside contamination.
Our cost effective module uses reliable resistive heating elements to achieve better than 2°C uniformity and up to 450°C heating in less than 15 seconds.
Critical to 300 mm wafer production, the module has extremely low backside metals and particulate contamination.
An optional cooling platen can be integrated in the same footprint to provide a very compact and easily interfaced unit.
Process gases can be introduced into both the hot and cold process chambers as an option.
Wafer pin lift mechanisms are integrated to both hot and cold platens to facilitate wafer transfer.
The module can be used as a standalone unit or integrated via a BOLTS compliant interface. The standard control interface can be either ethernet or serial or can be customized to your requirements.
“Our collaboration with Owens Design has resulted in an industry-leading tool with excellent performance parameters and a low cost of ownership that make it extremely attractive to our customers.”
Henrik Bækbo, CTO, Capres A/S