System Design for 3D Packaging: From Microns to Nanometers
This seminar is complementary to our Guests
Wednesday, April 19th, 2017
8:30 AM – 11:30 AM
Owens Design, 47427 Fremont Blvd., Fremont, CA | Map It
In order to deliver the performance, form factor, and cost requirements for consumer mobile devices, 3D packaging have become the preferred technology solution. 3D packaging refers to the use of stacked silicon wafers and/or singulated dies, and interconnecting them vertically using through-silicon vias (TSVs). While the benefits are many, there are also some challenges, including precision alignment, assembly and test.
In this seminar we have invited two speakers who are intimately familiar with equipment development of automated assembly and test for those devices. Our first speaker, Tony Smith, will share his knowledge of best practices for positioning mechanisms (with or without vision) . Our second speaker, Walter Silvesky, will share some examples that illustrate some of the challenges facing our customers in implementing 3D packaging and how to overcome them.
Do you need answers to active alignment problems? Do you need to better understand vision based automation? Or do you just want to learn more? If so, please join us for our seminar that will focus on automation to enhance 3D packaging.
Who should attend?
- Design Engineers
- Engineering Management
- Application Engineers
- Manufacturing Engineers
- Quality Managers
- Product & Ops Managers
Part 1: Best Practices Positioning Stages
- What are some of the challenges with Hexapods and other Positioning Mechanisms and way to address those
- Choosing the right solution
- Example/Live Demo
Part 2: Examples of Case Studies
- Problem Statements
- Customer Challenge
- Solution path
- Implementation of solution
Tony Smith, PE
Mr. Smith has over 20 years of experience in automation design in the semiconductor, consumer electronics, disk drive and solar industries among others. As Director of Engineering at Owens Design, he has managed the integration of vision systems into numerous automation projects for both inspection and guidance. Tony has been with Owens Design for over 18 years with a BS in Mechanical Engineering from Cal Poly San Luis Obispo and an MS from Santa Clara University.
Mr. Silvesky brings over 28 years of experience in automation and positioning devices in numerous applications from SEMI to consumer electronics. As a VP of Sales for ALIO Industries and over 27 years with Newport Corporation Walter has encountered numerous challenges related to tighter positioning and cleanliness specs. Walter is an Electrical Engineering graduate from The College of Aeronautics in New York City.
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