New Process Trends in Device Advanced Packaging Technologies
This seminar is complimentary to our Guests.
Thursday, October 18th, 2018
8:30 AM – 11:30 AM
Owens Design, 47427 Fremont Blvd., Fremont, CA | Map It
Device manufacturing has begun moving from small to nanoscale, while still requiring high performance and low power consumption. These recent trends are posing a challenge to manufacturers. In the ICS world, traditional CMOS designs are coming to an end as IC integration moves below 7 ηm nodes where Moore’s Law is being challenged and optical technology is increasingly integrated for interconnects and other functionality down to the chip level.
For this seminar, we have invited two industry experts who are on the forefront of the changing electronics landscape. Our first speaker, Dr Markus Arendt from SUSS MicroTec, will discuss the possibilities associated with excimer laser ablation technology within the advanced packaging space. Our second speaker, Scott Jordan from PI will discuss the packaging challenges that drive alignment automation in the ηm regimes.
If you have projects that relate to advanced packaging and would like to learn more about new trends in the field, this would be a great seminar to attend. Come and join us and learn from these industry experts.
Who should attend?
- Design Engineers
- Engineering Management
- Application Engineers
- Manufacturing Engineers
- Quality Managers
- Product & Ops Managers
Part 1: Excimer Laser ablation for novel patterning approaches in Advanced Packaging
(Presented by Markus Arendt)
- Comprehensive overview of the excimer laser ablation technology
- Advanced packaging applications and technology trends
- Q & A
Part 2: Addressing the Packaging Challenges of Silicon Photonics with Fast Alignment Automation
(Presented by Scott Jordan)
- Overview of Silicon Photonics alignment application challenges
- Review of technologies to align photonic elements for optimum optical efficiency in multiple packaging and test steps
- Emphasis on new high-speed approaches that address manufacturing economics
- Q & A
Markus Arendt, Ph.D / President, SUSS MicroTec / Photonic Systems, Inc.
Dr. Markus Arendt is President of SUSS MicroTec Photonic Systems, an equipment supplier for lithography solutions for Advanced Packaging, 3D Integration, and MEMS industries. Throughout his 12 years with SUSS MicroTec, he has held a range of senior-level positions, from Division Head for the Photomask Equipment Division to VP of Operations. Previously, he was General Manager of ANKA Synchrotron Radiation Source, and responsible for the commercialization of products and services with Synchrotron Radiation. Markus holds a Diploma in Engineering from the University of Karlsruhe/Germany, and a Ph.D. in Economic Engineering from the University of Heidelberg/Germany.
Scott Jordan / Head of Photonics, PI USA / PI (Physik Instrumente) L.P.
Scott Jordan is Head of Photonics for PI and a PI Fellow. A physicist, with an MBA in Finance/New Ventures, he has multiple contributions to positioning and optimization technologies.