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Semiconductor Industry

SOLUTION SET: Wafer Heat and Cool Stations

As backside contamination has become more critical with the introduction of 300 mm polished substrates, cost effective pre-heating and cooling wafers without introducing contamination is extremely difficult. Owens Design has developed a 300 mm wafer pre-heat and cool station that provides excellent uniformity and industry leading backside contamination.

Our cost effective module uses resistive heating elements that achieve better than 2 degree uniformity and up to 450°C heating in less than 15 seconds.

Critical to 300 mm wafer production, the module also has extremely low metals and backside particulate contamination.

A water cooled cooling platen can be integrated in the same footprint to provide a very compact and easily interfaced unit. Process gases can be introduced into both the hot and cold process chambers as an extra option.

Wafer pin lift mechanisms are integrated to both hot and cold platens.

The module can be integrated either standalone or via BOLTS compliant interface and the control interface is either ethernet or serial.

Typical Specifications

Cleanliness Reliability Serviceability Regulatory Compliance Interface Facilities
Additional Information

Solution Sets
Wafer Heat and Cool Stations


“The fact that Owens Design provided both design and manufacturing for our product made them the superior choice.”

Dennis Scott, President
Questar Products