Presentation Materials

• Software Reliability for Custom Machine Builders

Seminar Flyer: Building Software Flexibility and Reliability into Automated Systems

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Introduction

“It’s only software,” a semi-sarcastic comment we often hear in the equipment development world. Although it is meant to be funny, but this statement does reveal expectation of equipment software to be flexible and reliable to the surrounding environment, i.e. people, facility, and other production equipment. But what does it mean to have “flexible and reliable” equipment software? To better define and explain this topic, we have invited three software experts to talk about software architectures that may be able to help you improve your current or next equipment development project.

Equipment integration into a fully automated fab environment is highly susceptible to variations in manufacturing processes and equipment hardware. The industry behavior described in the SEMI standards is incomplete and cannot be relied upon on its own to successfully integrate equipment with AMHS systems. Our speakers, Alison and Mike, will explore the factors which make integration difficult, a configurable software design approach that handles behavior variations and how to test a complete tool solution within a simulated environment.

For the second part of our seminar, Owens Design’s own software director, Doug Putnam-Pite, will share his approach to address software reliability. As machine builders are driven to deliver complex equipment on short schedules often simultaneously debugging hardware and software. Many organizations do not consider software reliability until after they have delivered equipment. Issues with software reliability are often found by customers after delivery. Software reliability needs to be considered during equipment design. Successful software execution requires a multi-disciplinary approach to tool architecture and design that includes software engineering from the hardware concept stage.

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Seminar Agenda

Part 1: Building Flexibility into Automated Handling Systems (Speakers: Alison McKenzie, Mike Thiessen)

• Factors that make it difficult to integrate equipment into fully automated fabs
• Configurable equipment software design approach
• Complexities of software testing
• Demonstration

Part 2: Software Reliability for Custom Machine Builders (Speaker: Doug Putnam-Pite)

• What is software reliability?
• What unique challenges do custom machine builders face on software reliability?
• Current state of software reliability.
• Resources for improving software reliability for machine builders
• Lessons learned at Owens Design.

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Presenters

Sven Trautmann, Design Engineer at Atlas Technologies
Sven has 15 years of experience engineering and building products from digital cameras to cruise ships. He has been helping various industries solve their vacuum problems for the past five years. Trained in Germany as a journeyman pattern maker and certified by the German chamber of Trades and Skills.

Alison McKenzie, Product Manager at PEER Group Inc.
Alison sets the direction for PEER Group’s product portfolio comprising of factory automation solutions, equipment connectivity and test applications. With over 20 years of experience in manufacturing and equipment software engineering, Alison focuses on the delivery of high quality, flexible and reliable products. Helping customers achieve their goals is Alison’s top priority. Alison holds a Bachelor of Engineering Management in Computer Engineering and Management from McMaster University.

Mike Thiessen, Development Manager
Mike is a development manager with over 20 years of experience in software engineering, much of it in the semiconductor industry working with both fabs and equipment suppliers. For the past 8 years, Mike has led the PTO development team helping to evolve PTO into a complete tool control environment. During that time, Mike has worked with various equipment suppliers to integrate PTO on different types of equipment deployed in fabs around the world. Mike has a degree in Computer Information Systems.

Doug Putnam-Pite, Software Engineering Manager
Doug has over 25 years of experience in software engineering management in the semiconductor, disk drive, and solar industries. For the past 5 years, Doug has led the software development at Owens Design. Prior to joining Owens Design, Doug held software director and management positions at Olympus Integrated Technologies America, Silicon Valley Group and Watkins-Johnson Company. Doug has a BA in Computer Science from University of California at Santa Cruz.

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Seminar Co-Host

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This seminar is complimentary to our customers and Guests.

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Presentation Materials

• Designing Aluminium Vacuum Systems: Next Generation Vacuum
• Vacuum Sealing: Practical and Reliable

Seminar Flyer: Material Considerations for Vacuum Systems Designs

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Introduction

Vacuum systems are key ingredients for many process equipments that enable leading edge technologies. Many of us work with vacuum systems on a regular basis and are familiar with how systems should be designed and built. However, most of us don’t often have the latitude or time to explore new ways to design vacuum systems to allow for lower cost and better performance.

For this reason, we have invited two vacuum experts to talk about vacuum design approaches that may be able to help you improve your current or next vacuum design project. The first speaker, Sven Trautmann, will illustrate why using aluminum instead of stainless provides a better performance with a lower cost. He will share his design experiences and show the best way to apply aluminum to vacuum projects.

For the second part of our seminar, Rick Ricketts from Bay Seal will talk about how to choose the proper seal for different applications. Sealing a vacuum system is often not considered difficult when beginning a project. However, if not applied properly, an o-ring design error can often prove costly, if not detrimental, to your vacuum projects. Rick will answer any questions we have relating to proper vacuum seal designs.

Do you have current or upcoming projects that require vacuum design expertise? Would you like to learn more about the different options available to design your next vacuum chamber? If so, come and join us and learn from these industry experts.

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Seminar Agenda

Part 1: Designing Aluminum Vacuum Systems (Speaker: Sven Trautmann)

• Benefits of using aluminum
• Limitations of using aluminum
• Cost of ownership of aluminum chambers
• Case Studies

Part 2: How to Pick the Right Vacuum Seals (Speaker: Rick Ricketts)

• Common problems encountered
• Considerations that could affect vacuum seal design
• Uses of the available sealing material and cost control
• Case studies

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Presenters

Sven Trautmann, Design Engineer at Atlas Technologies
Sven has 15 years of experience engineering and building products from digital cameras to cruise ships. He has been helping various industries solve their vacuum problems for the past five years. Trained in Germany as a journeyman pattern maker and certified by the German chamber of Trades and Skills.

Rick Ricketts
Rick has been working at Bay Seal for the past 17 years. His primary focus has been on Silicon Valley’s OEMs with equipment designs that involve vacuum applications. Through Bay Seals, Rick spends most of his time on special projects that requires non-standard sealing applications or solves customer’s unexpected sealing problems. Rick used to race cars, was a helicopter pilot in Vietnam. He graduated from SF State with a degree in Economics.

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Seminar Co-Hosts

          

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This seminar is complimentary to our customers and Guests.

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Presentation Materials

• Essential Considerations for Prototype Development
• 3D Systems: Overview of Rapid Prototyping Systems

Seminar Flyer: Strategies and Tools for Successful Prototype Development

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Introduction

Prototype development, an exciting step for any company planning to launch a new product or revitalize an existing product with new capabilities. Navigating through a new prototype development is always a challenge. In this seminar, we will discuss the essential steps to ensure prototype success, in both conventional method and explore a method using 3D printing technology.

For the first portion of our seminar, Bob Fung, Owens Design VP of Engineering, will discuss top considerations for successful prototype development. Since prototyping complex automated equipment is Bob’s expertise, he will share his thoughts on the critical path to system development success.

For the second half of our seminar, we will learn about the technology of rapid prototyping, or layered manufacturing, using 3D printers. Current state of the art 3D printing involves the ability to quickly fabricate high resolution, high accuracy parts in a variety of materials. The latest machines can build parts with complex geometries in hours, not days. This technology is commonly used by engineering and design groups for quick generation of custom and short-run parts.

See flyer for more…

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Seminar Agenda

Part 1: Essential Considerations for Prototype Development (Speakers Bob Fung, Owens Design)

Part 2A: 3D Printing with Epoxy and Acrylic (Speakers Weng Lam, 3D Systems)

• Project by 3D Systems: Technologies
• Material and geometry capabilities.
• Appropriate applications.
• Printing logistics; CAD files, technology, time to print, etc.

Part 2B: Multicolor 3D Printing (Speakers Paul Mott, Peak Solutions LLC)

• ZPrinters by 3D System
• 3D printer selection
• 3D scanner demonstration

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Presenters

Bob Fung, VP of Engineering for Owens Design
Bob has a 30 year career in hard drive, semi and PV equipment development. Bob reviews and conceptualizes new capital equipment design on a daily basis and is becoming a world expert in substrate handling.

Weng Lam
Weng brings 20 plus years experience from the CAD/CAM and rapid prototyping industry. After studying mechanical engineering at the University of Utah he spent 9 years with GoEngineer, one of the largest SolidWorks dealers in the North America. During his tenure at GoEngineer his first role was applications engineer for various 3D CAD products and rapid prototyping equipment. Over the years his role evolved into sales and then finally VP of Operations. From there he spent 3 years with Actify developing their reseller channel for North America. Actify is a viewing and markup software application for high end 3D CAD data such as Catia and Siemens NX. In 2005 he joined ZCorporation to help develop and manage their reseller channel in the west coast for 3D printing sales and service.

This seminar is complimentary to our customers and Guests.

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Presentation Materials

• Environmental Health & Safety of Gas Boxes/Cabinets (Joseph B. Barsky, MS, CIH and Russ McDonald)
• User Configurable Interloc (mks)
• A Discussion of Gas Panels Design and Gas Related Issues (Chris Davis and Dan Mudd)

Seminar Flyer: Designing Gas Box for Advanced Applications and Safety

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Introduction

Gas box design has evolved from NPT fittings with Teflon tape to welded tubing and VCR fittings to surface mount with no tubes and fittings. With semiconductor industry’s shrinking technology nodes to sub 10nm, the demand for advancement in gas panel technology is much needed. MFC flow rates below 1sccm need to be less than 1% accurate of set point, not only at the MFC, but at the exit of the gas channels. There are many variables that will influence and challenge gas panel designs, considerations such as gas types, pressure sensitivity, back pressure, slug flow, discrete flow pulses, gas mixing, in-line verification, systems pressures and temperatures just to list a few. All of these factors have to be thought through to design a gas panel that achieves system performance and meeting cost targets. Dan Mudd and Chris Davis will be here from Dakota System to talk about their experiences in designing gas boxes for advance applications.

Certainly, regardless of the type of technology, safety is always a concern for gas box designs. To address gas box safety regulations, we have invited two compliance experts from Intertek to talk about regulatory codes and their experiences in certifying gas boxes.

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Seminar Agenda

Part 1: Advanced Gas Box Design (Speakers Chris Davis and Dan Mudd)

Part 2: Gas Box Safety (Speakers Joe Barsky and Russ McDonald)

• Regulations and Terminology
• Best Engineering Practices
• Safety Controls are not "Customer Options"
• EHS considerations when buying used equipment

Part 3: Implementation of Gas Box Interlocks (Speaker Ania Zemlerub)

• Discuss the science underlying programmable hardware safety solutions for semiconductor equipment
• Express metrics to judge overall system safetyand compare traditional hardware implementation of safety logic with user configurable solution
• At the end of the session the participants will have the ability to make an educated decision which design option is more suitable for their next safety interlocking system

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Presenters

Dan Mudd
In May of this year Dan joined Dakota Systems as its Chief Technology Officer. Dan has served in Engineering Management positions for the past 20+ years. During this time, he has focused primarily on the heartbeat of the gas and fluid delivery system in the design and manufacturing of Mass Flow Controllers. This development and design has led to well over 50 US, and International patents and more than five patent applications in process. Previous to Dakota Systems, Daniel held the position of Vice President of Advanced Technology for Horiba Semiconductor Division. Dan Received his BSME from University of Missouri-Rolla in 1973 and his MSEM in 1979.

Chris Davis
Chris received his BSChE from the University of Massachusetts-Lowell in 1984. Chris has more than 27 years of high technology industry experience, including the development, design, patent and introduction to the market of the all metal gas filters and pressure based mass flow controllers used in leading edge processes today. Prior to joining Dakota Systems in 2010, Chris was the VP of sales for HoribaSTEC and a Founder and CEO of Fugasity.

Joseph B. Barsky, MS, CIH
Joe is a certified industrial hygienist with over 28 years of semiconductor experience with IBM, Apple Computer, LSI Logic, Lam Research and many more through consultation with Intertek and others. Prior to joining Intertek, he helped with the Deepwater Horizon Oil Spill response in the Gulf supporting Florida and Alabama cleanup efforts. Joe has a MS degree in Environmental Health from the University of Cincinnati, College of Medicine and his BA in Ecology from Rutgers College. He is a past-president of the American Society of Safety Engineers-Greater San Jose Chapter and has several publications and patents.

Russell McDonald, Product Safety Engineer
Russ is a product safety engineer with over 32 years of semiconductor experience with Seagate Technology, Intertek GS3 Testing Services and other third party evaluators. Prior to becoming a third party evaluator he was a research and development engineer with Seagate Technology for 25 years. Responsibilities included researching state of the art design manufacturing techniques and the development of equipment to meet the industry’s technology advancements. Russ has vast experience in compliance, transferring, installing, training, and support of semiconductor equipment throughout the US, SE Asia, China, and Europe.

Ania Zemlerub, Product Manager MKS Instruments
I hold the position of Product Manger for Control group in MKS Instruments, a leading provider of equipment for semiconductor OEM's, for the last 5 years. I started my career with MKS Instruments 11 years ago as a design engineer for control platforms. Prior to MKS I was employed in various engineering and technical service positions in IDF (Israel Defense Forces). I hold an Electrical Engineering degree from Tel Aviv University.

This seminar is complimentary to our customers and Guests.

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Seminar Flyer: Important Considerations for Automated Equipment Design

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Introduction
Developing new equipment to manufacture products has been a well established engineering process for many decades. As equipment engineers develop systems daily, some mechatronic design considerations are often left out until a project is near completion. This is especially true in areas where electrical engineers, mechanical engineers, and marketing teams overlap. Such considerations include, but are not limited to, system cost of ownership, electrical/mechanical space constraints, and requirements to support mechanical motions.

For this seminar, Owens Design has invited two technical experts to speak on their experiences in developing automation systems. One speaker, Chris Prior, will help you reduce total system cost of ownership by replacing traditional pneumatic actuators with electronic cylinders. Philip Lipson, from Bosch, will give a talk on their recent publication, “Top 5 Considerations for Engineers.” Both of these speakers will help you better tackle your next mechatronics project.

Do you design or work with complex equipment regularly? Would you like to refresh your views on mechatronics design approaches? If so, come and join us and learn from these industry experts.

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Part 1: Top 5 Considerations for Engineers

• Top 5 Mechanical Considerations for Electrical Engineers
• Top 5 Electrical Considerations for Mechanical Engineers

Part 2: Reducing System Cost of Ownership by Using Pneumatic Alternatives

• Alternative solution to Pneumatics
• Cost Savings with Robo Cylinders
• Best Practices
• Suitability for use, i.e. trade-offs or considerations, case studies

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Presenters

Chris Prior
Chris received his BSME from Boston University College of Engineering and worked with Vicor as a Process Engineer working on mechanical destruction testing (Instron, fracture mechanics of materials, Scanning Electron Microscopy and FT/IR, etc) ultimately transitioning into magnetics, and developed equipment used to make high density power supplies. Chris has been at IAI America for more than 8 years as a senior technical support engineer covering application, specification and use of IAI products in various industries.

Philip Lipson
Philip is an applications engineer who has focused on automation/mechatronics for the past eleven years. Similar to Chris, Philip spent time at IAI focused on general automation projects for different industries. For the past six years with Bosch Rexroth, Philips has been working on automation solutions for the semiconductor, solar and medical industries. Philip has a BSEE degree from Louisiana Tech University.

This seminar is complimentary to our customers and Guests.

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Presentation Materials

• High Speed Handling (Matt Bauer)
• End Effector Design (Bob Fung)

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Part 1: High Speed Substrate Handling

A. Techniques for rapid transport of substrates

B. Process Automation

• Hard Tool Automation
• Robot Types
• Adept Robots
• Advantages/Disadvantages

C. Quality Control

• Design for on the fly alignment
• Option for high speed inspection

D. Optimization for Robotics

• Calculation of handling speeds
• Motion profile optimization
• Settling, Corners, Acceleration, I/O timing
• Layout, Workspace sizing

Part 2: End effector Design Considerations

• Types of end effectors for robotic applications
• Design consideration for various applications
• Advantages/Disadvantages to end effector types
• Case Studies

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Presenters

Matt Bauer
Matt is an Applications Engineer with Adept Technology, Inc. He is actively pursuing fixed and mobile robotics applications for material handling and packing automation. Matt brings innovative gripping solutions for mixed product handling and is excited to encounter challenging new projects.

Bob Fung
Bob is the VP of Engineering for Owens Design. Bob has a 30 year career in hard drive, semi and PV equipment development. Bob reviews and conceptualizes new capital equipment design on a daily basis and is becoming a world expert in substrate handling.

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Presentation Materials

• Key Elements of Vacuum Chamber Design
• Introduction to Vacuum Gauging (Neil T. Peacock)
• Heat Transfer in Vacuum (Igor Fidelman)

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Introduction
Many processes in the semiconductor, solar and disk drive industries use equipment that require vacuum chambers and vacuum related technologies. As chemical processes become more advanced, the requirements for vacuum designs also become more complex. In many projects that arrive at Owens Design, our engineering team is often challenged by vacuum designs with complex mechanical engineering requirements.

For this seminar, Owens Design will host two technical experts to share their past and current experiences in vacuum design. This seminar will address fundamental vacuum designs practices as well as well as engineering techniques and technologies to enable vacuum capabilities.

Do you have projects that require vacuum? Would you like to learn more about different techniques to address vacuum designs? Or do you simply need a refresher on vacuum design fundamentals? If so, come and join us and learn from these industry experts.

Who should attend?

• Engineering Management
• Software and Control Engineers
• Design Engineers Program Managers
• Equipment End Users Product Managers
• Manufacturing Engineers
• Equipment Buyers

Part 1 - Elements for Vacuum Chambers

A) Chambers

• Materials
• Fabrication methods
• Cleaning
• Packaging
• Acceptance/performance verification
• Putting into service
• Use and maintenance
• Upgrades/changes down the road

B) Measurement

• Pressure ranges and measurement units
• Measurement principles
• Technologies and accuracy

Part 2 - Heat Transfer in Vacuum

• How to Address Heat Transfer in Vacuum
• Heat Transfer Calculations

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Presenters

Neil T. Peacock
Neil Peacock has been a member of the technical and engineering staff at the Boulder, Colorado facility of MKS Instruments, Inc. for more than 25 years. His responsibilities have included the design, testing, characterization and calibration of thermal conductivity and ionization gauges. He has presented invited and contributed papers on vacuum gauging at national and international meetings and has published in the journals Vacuum and the Journal of Vacuum Science and Technology. He has written chapters for the “Handbook of Vacuum Science and Technology” published by Academic Press. He is the 2001-2010 AVS vacuum science representative to the IUVSTA (International Union of Vacuum Science, Techniques and Applications). He has served as Chairman and Program Chairman of the VTD and is current secretary of the VTD. He is also chair of the AVS Recommended Practice Sub-Committee on Ionization Gauges and a member of the AVS History Committee. He teaches short courses on basic vacuum, vacuum gauging and on sealing technology. Previously he served as a member of the editorial board of the Journal of Vacuum Science and Technology. He has been on the Board of the Rocky Mountain Chapter of the AVS since 2006, and was Chair of the Rocky Mountain Chapter in 2008. Mr. Peacock received a BA in Physics from the University of Colorado and has been a member of the AVS since 1985.

Igor Fidelman
Igor is a staff mechanical engineer at Owens Design. He has 20+ years of experience in automation and semiconductor equipment design. Many of Igor’s recent projects at Owens have involved complex heat transfer and motion in vacuum.

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Presentation Materials

• Virtual Prototyping (John Ebert)
• Specification of Vibration Isolation Systems (Wayne Vogen)
• RPM Vibration and Accoustic Calculator (Wayne Vogen)

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Introduction
As companies develop innovative technologies, new equipment prototypes are often introduced to support these innovations. Due to the competitive nature of the tech industry, there is never enough time and budget to conduct multiple iterations of prototype equipment development. Making the wrong prototype decisions can be costly, or sometimes fatal, to a company. So how can a fast pace tech company maximize the probability success with each prototype development cycle?

For this seminar, Owens Design has invited two experts in the subject of modeling/simulation and vibrations to share their knowledge on ways to predict and improve prototype development success. One of the speakers will focus on the available engineering analysis technologies that can help model structure stresses, thermal, vacuum, and fluid flow for given conditions. Our second speaker will focus on vibration isolation and discuss tradeoffs in choosing available systems such as passive mounts, negative stiffness system, air mounts with leveling systems and active systems. He will also present a method for predicting performance based on floor surveys. Both speakers will aim to help with under and/or over specifying components during the initial design phase.

Do you find yourself building multiple prototypes that’s costing too much time and money and would like to learn ways to improve? Would you like to learn ways to predict prototype results? Do you need help with analysis in the field of thermal, fluids, reactions or vibrations? If so, come and join us and learn from these industry experts.

Who should attend?

• Engineering Management
• R&D Engineers
• Design Engineers
• Program Managers
• Equipment End Users
• Product Managers

Part 1: Virtual Prototyping (John Ebert)

• Modeling for Design
  1. Thermal Modeling
  2. Fluid Flow and Reacting Flow Modeling
  3. Mechanical and Thermal Stress Modeling
  4. Other Physics and Sensor Modeling
• Modeling for Control Design
• Case Studies

Part 2: Vibration Isolation (Wayne Vogen)

• How to specify vibration isolation systems?
• Available vibration isolations
  1. Passive mounts
  2. Negative stiffness
  3. Air mounts
  4. Active systems
• How to predict vibration performance?

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Presenters

Mr. Jon Ebert
Mr. Jon Ebert received his Ph.D. in Mechanical Engineering from Stanford University in 1994 for his research at the High Temperature Gasdynamics Laboratory (HTGL), primarily in the area of radiative heat transfer and optical properties of materials. In 1989 Dr. Ebert began working as an engineering consultant performing thermal analysis for several companies throughout Silicon Valley. In 1996 Dr. Ebert joined SC as a Director in the Systems & Control Division where he has developed thermal models for Rapid Thermal Processing (RTP) chambers that have been used for design of model-based temperature controllers. He has also been involved in developing models for many other systems including batch furnaces, Chemical Vapor Deposition (CVD) reactors, sputtering chambers, CMP systems, as well as design and implementation of several experiments on RF sputter diode chamber, electron-beam deposition system, and Molecular Beam Epitaxy (MBE) chamber.

Mr. Wayne Vogen
Mr. Wayne Vogen received his M.S from UC Berkeley in mechanical engineering in 1967 and is an industry recognized expert at analyzing vibration and magnetic field problems with sensitive equipment. As the president of Vibration Engineering Consultants, Mr. Vogen has tested numerous structures to determine their vibration characteristics including frequency, damping and mode shapes. Mr. Vogen has conducted modal tests on such varied objects as an off shore platform, 30 passenger airplane, helicopter, electronic bonder, stepper, Winchester disc gimbal and a Guadinini violin. This has included modal testing of electrical equipment in nuclear power as part of the seismic equipment qualification program. Evaluation of the effects of blasts on various structures such as nuclear power stations, electrical power transmission towers and oil shale facilities have been accomplished involving both testing and modeling.

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Presentation Materials

• Optical Glass Metrology - Techniques and Limitation (Brian McMorris, Sick AG)
• Glass Metrology (Mike Boudreau, Technology Brewing Corp)
• Innovative Inspection and Measurement Solutions (Dr. Jochen Koenig, Dr. Schenk)

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Introduction
As technologies evolve and alternative materials are introduced as process substrates, the so-called routine challenge of automating substrate detection, handling, and inspection often becomes non-trivial. This is especially true for substrates that are transparent in nature or contiguous in form.

For this seminar, Owens Design has invited two technical experts, one who has experience in glass and transparent material detection and the other having extensive large scale materials inspection, to share their past and current experiences. This seminar will illustrate commonly used techniques and each of the speakers will focus on specific case studies that illustrate successful implementation of detection and inspection technologies.

Do you have projects that require handling and detection of transparent material? Would you like to learn more about the different techniques available for glass and thin film inspection? If so, come and join us and learn from these industry experts.

Who should attend?

• Engineering Management
• Software and Control Engineers
• Design Engineers
• Program Managers
• Equipment End Users
• Product Managers

Part 1: Detecting Transparent Materials

• Techniques for detecting and measuring a transparent glass surface
• Capacitance and ultrasonic sensors
• Infrared sensors for detection of glass edges
• Laser inspection and measurement of glass thickness, flatness: warp and bow
• 3D Machine Vision

Part 2: Thin Film Inspection

• Metrology for the entire production line
• Advantages of metrology
• SolarInspect and SolarMeasure

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Presenters

Mike Boudreau
Mike Boudreau, owner and President of Technology Brewing in Salmon Arm, BC. His firm's experiences include vision guidance for robots in applications as diverse as glass and silicon wafer metrology and planarity, inspection for lumber processing, machining and material removal on fiberglass fixtures, and many other applications.

Brian McMorris
Brian McMorris, Senior OEM Account Manager for the West Coast for SICK. Brian has a 30 year career in automation and controls. He is an active member in Robotics Industries Association, R15.06 / ISO10218 Safety Standards Committee, North American SEMI PV Group Steering Committee and has been a member of ISA.

Dr. Jochen Koenig
Dr. Jochen Koenig, managing Director of Schenk Vision LLC. Dr. Koenig was a System Engineer at Dr. Schenk in Munich, Germany. In 1995 he founded Schenk Inspection Systems in North and South America. Since, he has expanded the process engineering capabilities of Schenk to include other surface inspection systems for the solar, flat glass, film and foil, and semiconductor industries.

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Presentation Materials

• Networking Introduction (Jamie Gallant)
• Case Studies on Profibus (David DiGiorgio)

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Part 1: Networking Introduction (Jamie Gallant)

• Fundamentals of designing with automation networks
• Overview of available automation networks
• Pros and cons of each networking architecture
• Where and who uses each architecture
• Case study on DeviceNet

Part 2: Case Studies on Profibus (David DiGiorgio)

• How and why was the automation network selected?
• How is the network implemented?
• How is the network performing?

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Presenters

Jamie Gallant
Jamie Gallant, Regional Development Manager at Molex, Automation and Electrical Products Division. Jamie has spent the past 12 years assisting OEM and system integration companies in specifying hardware and components for successfully deploying automation networks. Molex is actively involved in the promotion and support of automation and networking technologies, and maintains a presence in industry standards committees and associations such as ODVA, PTO and IEC.

David DiGiorgio
David DiGiorgio, Director of Computer Engineering at Deterministic Systems Inc. (DSi). Mr. DiGiorgio supported himself through school as an amusement ride operator, thus started his love for roller coasters and spurred his career with DSi. While DSi provides solutions to various industries, its specialty is control systems for the entertainment industry, primarily amusement park rides.

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Presentation Materials

• Equipment Safety Considerations (Siemens/Owens Design)
• Design for Safety: Industry Expectations (Paul Breder)

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Introduction
Many emerging semiconductor, disk media and solar PV production technologies are now ramping up equipment design at a rapid pace to be in a position to capture market share when the economy takes an upturn. In the midst of rapid prototype development, equipment safety is often overlooked in the haste of competing for time-to-market. This case is especially true for emerging markets that has yet to develop industry standards or regulations.

For this seminar, Owens Design invited two technical experts who have conducted many years of equipment safety designs and evaluations to share their past and current experiences. This seminar will not only help you reduce development and liability cost, but it will help you achieve a faster time-to-market by avoiding project re-designs to address safety violations. Our discussion will focus on specific case studies to illustrate successful implementation as well as those that can occur and cause serious problems.

Do you need to better understand the issues around equipment safety and regulations? Or do you just want to refresh your safety knowledge and learn about recent changes in safety requirements? If you do, please join us for our seminar that will focus on practical design solutions for equipment safety.

Who should attend?

• Engineering Management
• Design Engineers
• Manufacturing Engineers
• Safety Engineers
• Program Managers
• Product Managers
• Equipment End Users

Part 1: Equipment Safety Evaluation (Pavol Breder)

• Regulatory bodies for SEMI, Solar and disk drive industries
• Basic design guidelines for equipment safety
• Commonly overlooked equipment safety guidelines
• What do third party look for during compliance certification

Part 2: Components to Use for Equipment Safety (John Hunt)

• Recent NFPA changes
• Industry accepted components for safety interlocks
• Case studies/Clips for Safety – The Movie
• Hands-On Examples

Presenters

Pavol (Paul) Breder
Pavol (Paul) Breder, Chief Engineer/Technical Manager for Intertek/Global Semiconductor safety Services. Mr. Breder has over thirty years of experience as an Electrical design engineer. He joined ITS//ETL in 1985 and has performed countless regulatory and product safety evaluations. Mr. Breder holds M.S. in Electrical Engineering from University of Electrical Engineering Kosice, Slovak Republic.

John Hunt
John Hunt, Application Specialist at Siemens. Mr. Hunt has over thirty years of industry experience and has been employed by Siemens Energy & Automation for the past eleven years. He held positions such as application engineer, software specialist, business development manager, and safety specialist working with industries such as food & beverage, automotive, aerospace, and among others.

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Presentation Materials

• Stage Metrology Concepts: Application Specific Testing (Hans Hansen)

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Introduction
Machine vision capabilities have continued to improve with the aid of advanced image processing and data analysis techniques and an increase in processing power. One thing that has remained constant and a key factor for design considerations is that the quality of the machine vision result is still dependent on the quality of the captured image.

Do you need some answers to current system inspection problems? Do you need to better understand the issues around substrate traceability? Or do you just want to learn more? If you do, please join us for our seventh series seminar that will focus on practical design solutions for machine vision inspection.

This presentation will focus on the factors that impact overall image capture quality; namely, illumination methodology, background design, and lens and camera selection. Our discussion will focus on specific case studies from solar, semiconductor, and flat panel. In particular there will be a general discussion on inspection of solar PV cells.

Who should attend?

• Engineering Managers
• Design Engineers
• Manufacturing Engineers
• Program Managers
• Product Managers

Technical Presentations

• Camera and Lens selection
• Background Design
• Image capture and data analysis
• Solutions for reflective surfaces, thin films, and low contrast

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Presenters

James Clark
James Clark, Application Engineering Manager at Cognex Corporation. Mr. Clark has 18 years of real world experience in defining and implementing vision applications.

Hans Hansen
Hans Hansen, Senior Systems Engineer at Owens Design. Mr. Hansen has 25 years of precision metrology equipment experience. He holds a BSME from Cal Poly, San Luis Obispo and MSME from UC Davis.

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Introduction
You just spent the last three months of your life designing a new tool with an integrated high resolution stage and with prototype hardware coming in you need to validate the design of the complete system. Stage characterization and solving system level tool vibration problems requires more than just the having the right test equipment. It also requires using correct test and measurement methodologies combined with design insight developed over years of seasoned experience.

Do you need some answers to current system level tool vibration, imaging, or acoustic problems? Do you need to understand how to specify and properly characterize both linear and rotary stages? Or do you just want to learn more? If you do, please join us for our sixth series seminar that will focus on practical design solutions for optimal wafer stage characterization and micro-vibration and acoustics issues relating to the design of high-resolution manufacturing, testing, and imaging equipment. Absolutely, the stuff they never taught you in school!

System level tool vibration and stage characterization must be addressed at several points in the product development cycle. This seminar will focus on the key technical areas of interest and will give the participant a better understanding of the critical issues concerning micro-vibration elimination, isolation, and control. Our discussion will focus on specific case studies to provide concrete examples of successes and failures.

Who should attend?

• Engineering Managers
• Design Engineers
• Manufacturing Engineers
• Program Managers
• Product Managers

Technical Presentations

• Stage Specification Fundamentals: Selection and characterization.
• Prototype Testing: Test methodology and analysis of dynamic response.
• Active Vibration Control: Viable solutions for generic applications.
• Site Evaluation: Concerns, measurements, and solutions.

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Presenters

Reuben Hale
Reuben Hale, P.E., President of Response Dynamics Vibration Engineering Inc. Response Dynamics is a vibration and acoustical engineering services company that has been providing technical solutions to the semiconductor and other high tech industries since 1984.

Hans Hansen
Hans Hansen, Senior Systems Engineer at Owens Design. Hans has 26 years of engineering experience including precision metrology equipment, semiconductor equipment and optical inspection equipment design. He holds a BSME from Cal Poly, San Luis Obispo and MSME from the University of California at Davis.

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Presentation Materials

• PWP Improvement through In-tool Ionization
• Clean Mechanism Design

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Introduction
You just spent the last three months of your life designing a new wafer chuck and wafer handling system under a very tight timeline. Wafer motion and placement is smooth and precise: just the way you designed it. However, when you get your first on-wafer contamination results back, you realize that you have a very serious particle contamination problem. You are not sure what went wrong or even how you are going to solve the problem. They didn’t teach you how to fix this stuff in school – did they?

Do you need some answers to current wafer contamination problems or just want to learn more? If you do please join us for the following seminar that will focus on practical design solutions for clean wafer transfer.

Absolutely, the stuff they never taught you in school!

Practical Design Solutions: How to eliminate and/or control wafer level particle generation for clean wafer handling.

As device geometries continue to shrink down to 65 and 45nm, the over all size of “device killer” particles is also shrinking. While gravity and airflow determine whether larger particles are deposited on the wafer surface, particle adhesion/attraction mechanisms must be considered when dealing with particles that are less than 40nm. Both the large and small particle regimes will be discussed in this seminar giving the participant a better understanding of the critical issues in respect to each area. As always, our discussions will focus on specific case studies to provide concrete examples of successes and failures.

Who should attend?

• Engineering Managers
• Design Engineers
• Manufacturing Engineers
• Program Managers
• Product Managers

Technical Presentations

• Design Fundamentals: Designing for clean wafer transfer and processing.
• Clean Mechanisms: What are the best solutions for actuators, slides, and lubricants for your application?
• Material Selection: What works best in your specific application?
• Adhesion/Attraction Base Particle Contamination: Identifying sources and validating potential solutions.
• Test Methods: How to determine the impact of ionization on PWP in semiconductor production tools?

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Presenters

Arnold Steinman
Arnold Steinman received his BSEE and MSEE form the Polytechnic Institute of Brooklyn and is the chief applied technologist for MKS, Ion Systems. He leads the SEMI ESD Task Force and is the SEMI representative on static control to the International Roadmap for Semiconductors (ITRS).

Bob Fung
Bob Fung is the director of engineering at Owens Design. He has 25 years of experience in capital equipment and clean mechanism design.

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Introduction
Whether you are designing a metrology tool or a wafer process chamger, there are always comples flow, dynamic stress and heat transfer factors that must be addressed to meet critical tool performance requirements. Using tool simulation software in the concept phase of a project can reduce overall tool performance risk, speed time to market and provide an optimized cost solution the first time.

Do you need answers to your problems in the area of complex gas/fluid flow, dynamic stress and heat transfer? Please join us for the fourth seminar in our practical design solutions series. The stuff they never taught you in school!

Feature Topic

as an engineer participating in the product development process, the ability to deliver expected results defines you and your company's reputation. Correct utilization and application of simulation software allows you to evaluate and optimize the performance of several design concepts before prototype metal is cut. This seminar will cover the key technical areas of interest by focusing on specific case studies to provide concrete examples of successes and failures.

Who should attend?

• Engineering Managers
• Design Engineers
• Manufacturing Engineers
• Program Managers
• Product Managers

Technical Presentations

• Design Problem Setup: Structure Frame and Constraints
• Interpretation of Results: Validity and Limitations

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Presenters

Metin Ozen
Metin Ozin, Ph.D., President, Ozen Engineering, Inc. (ANSYS Distributor). Dr. Ozen has extensive experience in the area of FEA and CFD Simulation. Prior to forming Ozen Engineering, Inc., Dr. Ozen held management positions at CFDRC and MCR Associates.

Chris LaRiviere
Chris LaRiviere, MSME, Ansys Corporation - Fluent Div. Mr. LaRiviere is an expert in applying CFD simulation solutions to the electronics, semiconductor, and fuel cell markets. Prior to joining Ansys - Fluent, Mr. LaRiviere performed fluid dynamics research for Ingersoll-Rand.

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Presentation Materials

• Vibration Control

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Introduction
As device geometries continue to shrink down from 90 to 65 to 45 nm, tool system level vibration becomes a critical design concern for high precision inspection and imaging equipment. Solving system level tool vibration problems requires more than just the having the right test equipment. It also requires using correct testing methodologies combined with design insight developed over years of seasoned experience.

Do you need some answers to current system level tool vibration, imaging, or acoustic problems? Or do you just want to learn more? If you do, please join us for our third series seminar that will focus on practical design solutions for micro-vibration and acoustics issues relating to the design of high-resolution manufacturing, testing, and imaging equipment. Absolutely, the stuff they never taught you in school!

Practical Design Solutions: Vibration - Elimination, Isolation, and Control

System level tool vibration must be addressed at several points in the product development cycle. This seminar will focus on the key technical areas of interest and will give the participant a better understanding of the critical issues concerning micro-vibration elimination, isolation, and control. Our discussion will focus on specific case studies to provide concrete examples of successes and failures.

Who should attend?

• Engineering Managers
• Design Engineers
• Manufacturing Engineers
• Program Managers
• Product Managers

Technical Presentations

• Design Fundamentals: Structural dynamic design concerns and analysis.
• Prototype Testing: Test methodology and analysis of dynamic response.
• Active Vibration Control: Viable solutions for generic applications.
• Site Evaluation: Concerns, measurements, and solutions.

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Presenters

Reuben Hale
Reuben Hale, P.E., President of Response Dynamics Vibration Engineering Inc. Response Dynamics is a vibration and acoustical engineering services company that has been providing technical solutions to the semiconductor and other high tech industries since 1984.

Michael Chung
Michael Chung, Automation Engineering Specialist, Mitsubishi Electric. Michael's expertise is in active servo dampening for vibration control and has been providing technical solutions to the semiconductor and other high tech industries for the past 6 years.

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Presentation Materials

• Vacuum Design Constraints and Considerations (Martin Aalund)

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As device geometries continue to shrink from 90 to 65 to 45nm, wafer level particle contamination becomes an ever-increasing problem. Wafer transfer in a vacuum environment can be a significant contamination contributor if proper design guidelines are not followed.

Do you need answers to current wafer contamination problems or just want to learn more? Please join us for our second seminar in our practical design solutions series. The stuff they never taught you in school!

Feature Topic: How to eliminate and control wafer level particle and metal contamination sources in a vacuum environment?

Whether it's in the process chamber or the wafer-handling environment, wafer level contamination is a critical requirement that must be addressed at the design stage. This seminar will focus on the key technical areas of interest, giving the participant a better understanding of the critical issues surrounding particle contamination while transferring wafers in a vacuum environment. Our discussion will focus on specific case studies to provide concrete examples of successes and failures.

Who should attend?

• Engineering Managers
• Design Engineers
• Manufacturing Engineers
• Program Managers
• Product Managers

Technical Presentations

• Design Fundamentals: Designing for clean wafer transfer and processing.
• Contamination: Identifying sources and validating potential solutions.
• Clean Mechanisms: What are the best solutions for actuators, slides, and lubricants for your application.
• Material Selection: What works best in your specific application.

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Presenters

Dr. Martin Aalund
Director of Engineering, KLA-Tencor
Prior to KLA-Tencor, Dr. Martin held technical positions at two robotic automation companies, PRI-Equipe and Smart Machines.

Dr. Steve Ludwick
Aerotech Engineering, Vacuum Stage Development

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Presentation Materials

• Clean Mechanism Design

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Introduction
You just spent the last three months of your life designing a new wafer chuck and handling system under a very tight timeline. Wafer motion and placement is smooth and precise; just the way you designed it. However, when you get your first on-wafer contamination results back, you realize that you now have a very serious problem. The data confirms that you failed particle and backside metals contamination specifications. What went wrong? They didn't teach you how to fix this stuff in school did they?

Feature Topic: How to eliminate and control wafer level particle and metal contamination sources in your design.

Whether it is the process chamber or the wafer-handling environment wafer level particle and metal contamination are critical requirements that must be addressed at the design stage. This seminar will focus on semiconductor equipment design for cleanrooms and will give the participant a better understanding of the critical issues surrounding wafer level particle and metal contamination. Our discussion will focus on specific case studies to provide concrete examples of successes and failures.

Who should attend?

• Engineering Managers
• Design Engineers
• Manufacturing Engineers
• Program Managers
• Product Managers

Technical Presentations

• Design Fundamentals: Designing for clean wafer transfer and processing.
• Contamination: Identifying sources and validating potential solutions.
• CFD Analysis: What it is and how do you use it to improve your design.
• Clean Mechanisms: What are the best solutions for actuators, slides, and lubricants for your application.
• Material Selection: What works best in your specific application.

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Presenters

Bob Fung
Engineering Director, Owens Design

Sameer Abu-Zaid
Contamination Director, Asyst Technologies

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