Industry Proven Solutions
As the semiconductor industry drives to ever-decreasing line widths and increasing automation, equipment solutions must continually be reinvented. Current challenges include decreasing backside contamination, increasing throughputs, and improved integration to factory automation systems.
Owens Design has developed a family of custom wafer-handling solutions from low-contact, wafer heat stations to precision wafer-handling mechanisms, integrated BOLTS modules, and full Metrology Automation Platforms.
Owens Design Solutions for the SemiConductor Industry
Metrology Automation Platforms
Metrology equipment often has special automation needs. Requirements can include optical integration, vibration isolation, handling 2-inch to 300mm wafers, and tight packaging constraints. Owens Design’s metrology platform building blocks allow our customers to focus on the metrology process while we provide the system frame, user interface, staging, power and 300mm factory automation.
Wafer Heating and Cooling Stations
For those occasions when the wafer must be pre-heated or post-cooled in your process, Owens Design has developed an innovative low-contamination, high-uniformity heating and cooling module. Our module incorporates a pin chuck and can be integrated into a BOLTS compliant interface or standalone module.
Unique or challenging wafer-handling requirements often cannot be met with off-the-shelf solutions. Owens Design has created a family of custom wafer-handling mechanisms for these special situations. In addition to handling all wafer sizes, our capabilities include wet, high-temperature, atmospheric and vacuum environments, low-contamination platens, and custom FOUP automation needs.
The BOLTS interface provides a standardized mounting configuration for more than just load ports. Owens Design has integrated both metrology and process modules into a BOLTS configuration providing simplified integration into existing EFEMs.